Holder assembly system and method in an emitted energy system for photolithography

ABSTRACT

An emitted energy system for use in photolithography may include a holder assembly operable to precisely align a diffuser and a nozzle. In accordance with one embodiment of the present invention, a holder assembly ( 30 ) may comprise a nozzle mounting system ( 414 ) coupled to a housing assembly ( 400 ) to secure a nozzle ( 22 ). A diffuser mounting system ( 430 ) may be coupled to the housing assembly ( 400 ) to secure a diffuser ( 28 ). An alignment system ( 450 ) may operate to align the nozzle ( 22 ) and the diffuser ( 28 ) in a spatial relationship with each other to optimize operation of the diffuser ( 28 ) in relation to the nozzle ( 22 ).

RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.09/055,035 filed Apr. 3, 1998, now U.S. Pat. No. 6,180,952, which isrelated to the following applications:

Ser. No. 09/055,024 filed Apr. 3, 1998, now abandoned, which is a CIP ofSer. No. 8/794,802 filed Feb. 4, 1997, now U.S. Pat. No. 6,133,577;

Ser. No. 09/054,831 filed Apr. 3, 1998, now U.S. Pat. No. 6,105,885;

Ser. No. 09/054,987 filed Apr. 3, 1998, now U.S. Pat. No. 6,065,203;

Ser. No. 09/055,034 filed Apr. 3, 1998, now abandoned; and

Ser. No. 09/054,977 filed Apr. 3, 1998.

TECHNICAL FIELD OF THE INVENTION

This invention relates generally to the field of mounting systems, andmore particularly to a holder assembly system and method for aligning anozzle and a diffuser in an emitted energy system that may be used forphotolithography production of semiconductor components.

BACKGROUND OF THE INVENTION

Photolithographic fabrication of semiconductor components, such asintegrated circuits and dynamic RAM (DRAM) chips, is customary in thesemiconductor industry. In photolithographic fabrication, light may beused to cure or harden a photomask that is used to form a pattern ofconductive, semiconductive, and insulative components in thesemiconductor layer. The resulting pattern of conductive,semiconductive, and insulative components on the semiconductor layerform extremely small microelectronic devices, such as transistors,diodes, and the like. The microelectronic devices are generally combinedto form various semiconductor components.

The density of the microelectronic devices on the semiconductor layermay be increased by decreasing the size or geometry of the variousconductive, semiconductive, and insulative components formed on thesemiconductor layer. This decrease in size allows a larger number ofsuch microelectronic devices to be formed on the semiconductor layer. Asa result, the computing power and speed of the semiconductor componentmay be greatly improved.

The lower limit on the size, often referred to as the linewidth, of amicroelectronic device is generally limited by the wavelength of lightused in the photolithographic process. The shorter the wavelength oflight used in the photolithographic process, the smaller the size orlinewidth of the microelectronic device that may be formed on thesemiconductor layer. Semiconductor component fabrication may be furtherimproved by increasing the intensity of the light used in thephotolithographic process, which reduces the time the photomask materialneeds to be radiated with light. Accordingly, the greater the intensityof light used in the photolithographic process, the shorter the time thephotomask material is radiated with light. As a result, thesemiconductor components may be produced faster and less expensively.

Extreme ultra-violet (EUV) light has a very short wavelength and ispreferable for photolithographic fabrication of semiconductorcomponents. Conventional methods of generating EUV light typicallyinclude impinging an energy source into a hard target to produce, orradiate, EUV light. The energy source may be a high energy laser,electron beam, an electrical arc, or the like. The hard target isgenerally a ceramic, thin-film, or solid target comprising suchmaterials as tungsten, tin, copper, gold, solid xenon, or the like.Optics, such as mirrors and lenses, are used to reflect and focus theEUV light on the semiconductor layer.

Conventional energy beam systems and processes suffer from numerousdisadvantages. One disadvantage of conventional methods of producing EUVlight is that debris from the energy source/target interaction isproduced during the production of the EUV light. The production ofdebris increases with the intensity of the energy source and results inthe target being degraded and eventually destroyed. The debris may coatand contaminate the optics and other components of the energy beamsystem, thereby reducing the efficiency and performance of the system.The reduced performance requires a greater frequency of systemmaintenance and system downtime.

SUMMARY OF THE INVENTION

Accordingly, a need has arisen for an improved emitted energy system andmethod. One embodiment of an improved emitted energy system and methodmay include a holder assembly for aligning a nozzle and a diffuser. Thepresent invention provides a holder assembly system and method thatsubstantially eliminates or reduces problems associated with the priorsystems and methods.

In accordance with the present invention, a holder assembly may comprisea nozzle mounting system coupled to a housing assembly to secure anozzle in the housing. A diffuser mounting system may also be coupled tothe housing assembly. The diffuser mounting system may secure a diffuserin the housing assembly. An alignment system may operate to align thenozzle and the diffuser in a spatial relationship with each other tooptimize operation of the diffuser in relation to the nozzle.

Conventional alignment systems can use separate holders for the nozzleand the diffuser. The separate holders necessitate the shutdown of theenergy beam system during maintenance, which is extended due to the timerequired to align the nozzle and the diffuser. In addition, conventionalalignment systems may not maintain precise alignment between the nozzleand the diffuser during extended periods of operation. The number andextended length of the maintenance operations increases production costsand decreases the production of semiconductor components.

The present invention provides several technical advantages. Forexample, the invention allows the nozzle and the diffuser to beprealigned and checked rapidly as a subunit prior to installation into avacuum chamber. Accordingly, the system's downtime and maintenance maybe decreased, thereby increasing productivity. Another technicaladvantage of the present invention is that the holder assembly maintainsprecise alignment between the nozzle and the diffuser over an extendedperiod of operational time. A further technical advantage of the presentinvention is that the holder assembly may include provisions to cool thenozzle and diffuser during operation of the emitted energy system.

Other technical advantages will be readily apparent to one skilled inthe art from the following figures, descriptions, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, the objectsand advantages thereof, reference is now made to the followingdescriptions taken in conjunction with the accompanying drawings inwhich:

FIG. 1 is a drawing in section with portions broken away illustrating anemitted energy system in accordance with one embodiment of the presentinvention;

FIG. 1A is a perspective view of a photolithography system interface inaccordance with one embodiment of the present invention;

FIG. 2 is a cross section illustrating a nozzle used in the emittedenergy system of FIG. 1 in accordance with one embodiment of the presentinvention;

FIG. 3 is a cross section illustrating a method of manufacturing used tofabricate very small diameter deep passages, such as a very smalldiameter deep passage that may be used in the nozzle illustrated in FIG.2 in accordance with one embodiment of the present invention;

FIG. 4 is a cross section illustrating a diffuser used in the emittedenergy system of FIG. 1 in accordance with one embodiment of the presentinvention;

FIG. 5 is a side view in section with portions broken away illustratinga holder assembly used in the emitted energy system of FIG. 1 inaccordance with one embodiment of the present invention; and

FIG. 6 is a rotated side view in section with portions broken awayillustrating the holder assembly of FIG. 5 in accordance with oneembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The preferred embodiment of the present invention and its advantages arebest understood by referring to FIGS. 1 through 6 of the drawings, likenumerals being used for like and corresponding parts of the variousdrawings.

FIGS. 1 through 6 illustrate an emitted energy system in accordance withone embodiment of the present invention. As described in more detailbelow, the emitted energy system may comprise a fluid system and anenergy system that interact to produce a beam of emitted energy. Theemitted energy may be extreme ultra-violet light for use inphotolithographic production of microelectronic devices in semiconductorcomponents. The extreme ultra-violet light allows the economicalfabrication of microelectronic devices having linewidths smaller than100 nanometers. Accordingly, the emitted energy system increases thenumber of microelectronic devices that may be placed on a semiconductorlayer, thereby increasing the potential computing power and speed of asemiconductor component, such as an integrated circuit chip, memorychip, or the like.

FIG. 1 is a drawing in section with portions broken away illustrating anemitted energy system 10 in accordance with one embodiment of thepresent invention. In this embodiment, the emitted energy system 10 maybe used to generate extreme ultra-violet light for use inphotolithography. It will be understood that the emitted energy system10 may be otherwise used without departing from the scope of the presentinvention. For example, the emitted energy system 10 may be used toproduce other wave lengths of light and can be used for welding,machining, chemistry, biological research, materials research,communication systems, and the like.

Referring to FIG. 1, the emitted energy system 10 comprises a fluidsystem 12 and an energy system 14 that interact to generate an emittedenergy 16. The emitted energy 16 may be collected and directed by anoutput optics 18 to a target 20. It will be understood that the emittedenergy system 10 may include other suitable components without departingfrom the scope of the present invention.

In one embodiment, the fluid system 12 includes a nozzle 22 and a fluidsupply system 24. In another embodiment, the fluid system 12 includesthe fluid supply system 24 and a subsystem 26 comprising the nozzle 22,a diffuser 28, and a holder assembly 30 that maintains the alignmentbetween the nozzle 22 and the diffuser 28.

The fluid supply system 24 includes a supply system 32. The supplysystem 32 operates to supply a fluid 34 to the nozzle 22. In oneembodiment, the supply system 32 includes a supply tank 36 containingpressurized fluid 34, connecting lines 38 between the supply tank 36 andthe nozzle 22, and a pressure regulator (not shown). It will beunderstood that the supply system 32 may include other suitablecomponents without departing from the scope of the present invention.For example, the supply system 32 may include a flow regulator, afilter, or other suitable devices.

The pressurized fluid 34 flows through the nozzle 22 and is dischargedin a fluid plume 40. In general, the fluid plume 40 is formed within achamber 42. The chamber 42 may be evacuated to a hard vacuum on theorder of one millitorr. It will be understood that the chamber 42 may beotherwise evacuated without departing from the scope of the presentinvention.

The fluid 34 is generally gaseous in form as it flows through the nozzle22. In one embodiment, the fluid 34 is a noble gas such as xenon. Itwill be understood that the fluid 34 may be any material or combinationof materials that produce the desired emitted energy 16 during theinteraction of the fluid system 12 and the energy system 14 withoutdeparting from the scope of the present invention. For example, thefluid 34 may be iodine, sodium, a noble gas such as argon or helium, orother suitable material.

In one embodiment, the chamber 42 captures the fluid 34 exiting thenozzle 22. In another embodiment, the diffuser 28 captures substantiallyall of the fluid 34 in the fluid plume 40. In this embodiment, theholder assembly 30 operates to maintain precise alignment between thenozzle 22 and the diffuser 28 to optimize operation of the diffuser 28such that the fluid plume 40 is substantially captured by the diffuser28. It will be understood that the fluid 34 may be otherwise capturedwithout departing from the scope of the present invention.

The fluid supply system 24 may also include a recycle system 44 thatoperates to remove the captured fluid 34. The captured fluid 34 may thenbe recirculated back to the supply system 32 for reuse. In oneembodiment, the recycle system 44 is connected to the chamber 42. Inanother embodiment, the recycle system 44 is connected to the diffuser28 and the chamber 42. It will be understood that the recycle system 44may be otherwise configured without departing from the scope of thepresent invention.

The recycle system 44 includes a chamber pump 46 connected to thechamber 42 to collect and remove the fluid 34 and any contaminates fromthe chamber 42. It will be understood that the chamber pump 46 maycomprise any suitable device or system for evacuating the chamber 42without departing from the scope of the present invention. For example,the chamber pump 46 may be a roughing pump, turbomolecular vacuum pump,cryopump, ion pump, or other suitable pump system or combinationthereof.

In one embodiment, the recycle system 44 may include a diffuser pump 48connected to the diffuser 28 to collect and remove the fluid 34 capturedby the diffuser 28. It will be understood that the diffuser pump 48 maycomprise any suitable device or system for removing the captured fluid34 from the diffuser 28 without departing from the scope of the presentinvention. For example, the diffuser pump 48 may be a compressor,circulating pump, or other suitable pump system or combination thereof.

The recycle system 44 may also include a compressor 50 connected to thechamber pump 46 and/or the diffuser pump 48. The compressor 50 operatesto receive the fluid 34 from the chamber pump 46 and/or the diffuserpump 48, compress the fluid 34, and then recycle the fluid 34 to thesupply system 32. The recycle system 44 may also include a filter system(not shown), a cooling system (not shown), and connecting lines (notshown) between the recycle system 44 and the supply system 32. It willbe understood that the recycle system 44 may comprise other suitablecomponents without departing from the scope of the present invention.

In operation, the fluid supply system 24 may provide pressurized fluid34 in the form of a gas to the nozzle 22. The pressurized fluid 34 flowsthrough the nozzle 22. The discharge, or exit, of the fluid 34 from thenozzle 22 forms the fluid plume 40 in the chamber 42. The fluid 34forming the fluid plume 40 is collected and removed by the recyclesystem 44.

In one embodiment, the recycle system 44 operates to remove the fluid 34from the chamber 42. In this embodiment, the volume of the fluid 34discharged from the nozzle 22 is such that the chamber pump 46 operatesto maintain an acceptable vacuum within the chamber 42 during operationof the emitted energy system 10.

In an embodiment in which the recycle system 44 is coupled to thediffuser 28, the kinetic energy of the fluid 34 in the fluid plume 40directs the fluid 34 into the diffuser 28, allowing the diffuser 28 tocapture substantially all of the fluid 34 in the fluid plume 40. Thediffuser 28 converts the kinetic energy of the fluid 34 into pressure toreduce the pumping speed requirements of the chamber pump 46. The holderassembly 30 maintains the alignment and position between the nozzle 22and the diffuser 28.

The recycle system 44 may compress, cool, and filter the fluid 34 beforereturning the fluid 34 to the supply system 32. The fluid 34 may then becirculated back to the nozzle 22 for reuse.

The fluid flow characteristics of the fluid 34 in the fluid plume 40 arestrictly controlled and substantially defined by the design of thenozzle 22. The design of the nozzle 22 generally controls the quantityof the fluid 34 being discharged, the average size of clustered gasatoms or molecules of the fluid 34 in the fluid plume 40, the velocityof the fluid 34, and the temperature of the fluid 34, as well as thesize and shape of the fluid plume 40. These flow characteristics mayindividually and in combination affect the operation of the emittedenergy system 10.

The fluid 34 discharged from the nozzle 22 may be subsonic orsupersonic. In one embodiment, the fluid 34 in the fluid plume 40 flowsat a velocity of approximately Mach 3. In this embodiment, as discussedin detail below, the nozzle 22 may be designed to allow the atoms ormolecules of the fluid 34 to cluster. Clustering of the fluid 34increases the average particle size of the clustered atoms or moleculesof the fluid 34 in the fluid plume 40. The clustered atoms or moleculesof the fluid 34 in the fluid plume 40 may have an optimum cluster sizewhich may increase the quantity of the emitted energy 16 produced duringthe interaction of the fluid system 12 and the energy system 14.Accordingly, the efficiency of the emitted energy system 10 isincreased. Additionally, the emitted energy system 10 produces arelatively debris-free emitted energy 16 of a particular wavelength, orwavelengths, at an intensity that may be used in photolithographyfabrication processes.

As illustrated in FIG. 1, the energy system 14 interacts with the fluidplume 40 within the chamber 42 to produce the emitted energy 16. Therecycle system 44 is used to evacuate the chamber 42 to a very lowvacuum pressure and to remove any contaminates from the chamber 42.Contaminates may include any atoms, molecules, ions, and materialparticulate contained within the chamber 42 that may degrade orinterfere with the operation of the emitted energy system 10.

The energy system 14 may include an energy source 60 and an input optics62 that are used in connection with the chamber 42 and the fluid plume40 to generate the emitted energy 16. The energy source 60 and inputoptics 62 operate to produce an input energy 64 that excites the fluid34 in the fluid plume 40 into producing the emitted energy 16. Theenergy source 60 and the input energy 64 are often dependent upon thefluid 34 used in the emitted energy system 10. In an embodiment in whichthe fluid 34 comprises xenon and the input energy 64 is a high powerlaser beam having a wavelength of approximately 1.064 microns, theemitted energy 16 is extreme ultraviolet light that may be used inphotolithography production of semiconductor components. In thisembodiment, the input energy 64 is produced by a Nd:YAG laser. It willbe understood that the input energy 64 may be otherwise produced and beany other suitable energy that excites the fluid 34 into producing thedesired wavelength(s) of the emitted energy 16 without departing fromthe scope of the present invention. For example, the input energy 64 maybe an electric arc, ion or electron beam, coherent light such as a laserbeam having different wavelengths, microwaves, or any other suitableenergy. It will be further understood that other types of emitted energy16 may be generated by the emitted energy system 10 without departingfrom the scope of the present invention.

The input energy 64 may be focused through the input optics 62 into thefluid plume 40 to form a plasma 66 that produces the emitted energy 16.The input energy 64 may be directed into the fluid plume 40 such thatthe quantity of the emitted energy 16 reabsorbed by the fluid 34 isminimized. Thus, the input energy 64 may be focused on the fluid plume40 proximate the nozzle 22 such that the distance the emitted energy 16travels through the fluid plume 40 is minimized. Some suitable types ofinput energy 64 do not require input optics 62, such as an electric arc.It will be understood that the present invention includes such types ofinput energy 64.

In one embodiment, the input optics 62 may be a system of mirrors andlenses that collect, transmit, and focus the input energy 64 into thefluid plume 40. It will be understood that the input optics 62 may beany suitable device or system for collecting, transmitting, or directingthe input energy 64 into the fluid plume 40 without departing from thescope of the present invention.

The emitted energy 16 may be collected and directed by the output optics18 to the target 20. In general, the output optics 18 will be arrangedproximate the input energy 64, as the greatest intensity of the emittedenergy 16 is produced proximate the input energy 64. In one embodiment,the output optics 18 may include a mirror system which substantiallysurrounds one end of the holder assembly 30 to reflect the emittedenergy 16 through a system of mirrors and lenses. It will be understoodthat the output optics 18 may be any suitable device or system forcollecting, transmitting, or directing the emitted energy 16 at thetarget 20 without departing from the scope of the present invention.

The target 20 may be any material or system at which the emitted energy16 is directed. In one embodiment, the target 20 is a photolithographysystem interface 68 used in the photolithographic production ofelectronic devices. Other embodiments may utilize the emitted energy 16in such simple applications as welding or manufacturing, or in suchcomplicated applications as applied physics research, materialsresearch, biological research, communications systems, and the like.

FIG. 1A is a perspective view of the photolithography system interface68 according to one embodiment of the present invention. In thisembodiment, the emitted energy system 10 is used in the fabrication of asemiconductor device 70, such as an integrated circuit (IC), memorychip, application specific integrated circuit (ASIC), or the like.

The photolithography system interface 68 may include a mask 72 and asemiconductor target 74. The mask 72 allows only a portion of theemitted energy 16 incident upon the mask 72 to reach the semiconductortarget 74. The mask 72 includes a mask pattern 76 such that the portionof the emitted energy 16 which reaches the semiconductor target 74 is ina pattern corresponding to the mask pattern 76. In other words, byscreening the emitted energy 16 incident upon the mask 72, the mask 72operates to replicate the mask pattern 76 onto the semiconductor target74.

In one embodiment, the mask 72 comprises a mask pattern 76 of reflectiveregions surrounded by non-reflective regions. The emitted energy 16incident on the non-reflective regions of the mask 72 is screened, whilethe emitted energy 16 incident on the reflective regions of the mask 72is reflected to the semiconductor target 74. It will be understood thatthe mask 72 may comprise other devices or systems for forming a patternof emitted energy 16 on the semiconductor target 74 without departingfrom the scope of the present invention. For example, the mask 72 may bea one-to-one mask, a de-magnifying mask, a reticle mask, or othersuitable mask.

The semiconductor target 74 may comprise a substrate 78 covered by aphotoresist layer 80. The substrate 78 may be a semiconductor such as awafer formed from a single-crystalline silicon material, an epitaxialsemiconductor layer, a polycrystallirie semiconductor material, or ametallic such as aluminum, tungsten, or copper, or any other suchsuitable material. It will be understood that the substrate 78 maycomprise other suitable materials and layers without departing from thescope of the present invention.

The photoresist layer 80 may be any suitable material that reacts to theemitted energy 16. For example, the photoresist layer 80 may react tothe emitted energy 16 by curing, hardening, or positive or negativepolymerization. in one embodiment, the photoresist layer 80 comprisesExtreme UltraViolet (EUV) photoresist material. It will be understoodthat the photoresist layer 80 may be other suitable photo-reactingmaterial without departing from the scope of the present invention.

A photoresist mask 82 is formed within the photoresist layer 80 byexposing the photoresist layer 80 to a pattern of emitted energy 16 suchthat the portion of the photoresist layer 80 exposed to the emittedenergy 16 reacts to the emitted energy 16 by curing, hardening,polymerizing, or the like. The unreacted portion of the photoresistlayer is then removed, exposing a portion of the underlying substrate78. The remaining portion of the photoresist layer 80 forms thephotoresist mask 82.

A structure 86 may be formed by semiconductor fabrication processesperformed on the exposed portions of the underlying substrate 78, suchas wet etching, dry etching, ion implantation, or other suitablesemiconductor fabrication processes. The structure 86 may be a componentof a microelectronic device, such as a gate, source/drain, moat, or thelike. The structure 86 may be processed to form the semiconductor device70. The photolithography system interface 68 may include other devicesand systems for directing the emitted energy 16 without departing fromthe scope of the present invention. For example, the photolithographysystem interface 68 may include additional optics, mirrors, or masks,that may affect the pattern of the emitted energy 16 impinging thephotoresist layer 80.

In operation, the photolithography system interface 68 receives theemitted energy 16 from the output optics 18 and directs the emittedenergy 16 toward the mask 72. The mask 72 screens the emitted energy 16such that a pattern of the emitted energy 16 is directed toward thephotoresist layer 80 of the semiconductor target 74. The portion of thephotoresist layer 80 upon which the emitted energy 16 is incident,reacts to the emitted energy 16. The non-reacted portion of thephotoresist layer 80 is then removed to expose a portion of theunderlying substrate 78. The remaining portion of the photoresist layer80 forms the photoresist mask 82 in a pattern corresponding to the maskpattern 76 in the mask 72. Semiconductor fabrication processes such aswet etching, dry etching, ion implantation, or other suitable processesmay then be performed on the exposed substrate 78 to form the structure86. For example, the substrate 78 may be subjected to an ionimplantation process such that a source region and a drain region of atransistor is formed. The substrate 78 could also be subjected to aplasma-based etch process such as a reactive ion etch (RIE) thatanisotropically etches the substrate 78 to form an element of atransistor, such as a gate or a sidewall body.

The structure 86 may be processed by any suitable semiconductorfabrication process. The semiconductor fabrication processes ac: on theunderlying substrate to form the structure 86, which may compriseportions of microelectronic devices such as transistors, capacitors,diodes, or the like. Various microelectronic devices may be combined toform a semiconductor device such as an integrated circuit (IC), memorychip, application specific integrated circuit (ASIC), or other suchelectronic devices.

In short, the emitted energy system allows the economical anddebris-free production of an emitted energy. The emitted energy isproduced in a manner that reduces contamination of the components of theemitted energy system. For example, the input and output optics, alongwith the surfaces of the diffuser, nozzle, chamber, and the holderassembly will not require the same level of maintenance and cleaning asrequired in conventional systems for producing an emitted energy. Inaddition, the fluid used to produce the emitted energy is not damaged ordestroyed by operation of the emitted energy system. Furthermore, theemitted energy system may be economically produced because the pumpingrequirements of the recycle system may be reduced. Specifically, thepumping requirements of the chamber pump may be reduced.

In photolithographic applications, the emitted energy system willpreferably produce extreme ultra-violet light at high intensity. Thehigh intensity ultra-violet light attainable with the present inventionwill facilitate the cost effective fabrication of semiconductor devicesthat have microelectronic device features with linewidths of 100nanometers or less. The emitted energy system will also allow a greaternumber of microelectronic devices to be placed within the semiconductordevice, which will correspondingly increase the computing power andspeed of the semiconductor device.

FIG. 2 is a cross section illustrating the nozzle 22 in accordance withone embodiment of the present invention. In this embodiment, the nozzle22 is used to generate the fluid plume 40. It will be understood thatthe nozzle 22 may be otherwise used without departing from the scope ofthe present invention. For example, the nozzle 22 may be used as adirectional steering jet on a space vehicle, a fuel injector for acombustion chamber, an ink jet in an ink jet printer, or any othersuitable use.

In one embodiment, the nozzle 22 includes a generally cylindrical nozzlebody 100 having an up-stream end 102 and a down-stream end 104. Thenozzle body 100 may be tapered adjacent to the down-stream end 104 ofthe nozzle body 100 to form a nozzle tip 106. The up-stream end 102 ofthe nozzle body 100 may include a boss 108 for connecting the up-streamend 102 of the nozzle 22 to the supply system 32. For example, theup-stream end 102 may be connected by welding, brazing, hydraulicfittings or other suitable standard hydraulic means to the supply system32. It will be understood that the nozzle body 100 may be otherwiseshaped and configured without departing from the scope of the presentinvention.

A nozzle cavity 110 is disposed within the nozzle body 100 between theup-stream end 102 and the down-stream end 104. The nozzle cavity 110 mayinclude an inlet passage 112 defined within the up-stream end 102 of thenozzle cavity 110. The up-stream end 102 of the inlet passage 112 mayform an inlet 114. The down-stream end 104 of the inlet passage 112 mayform a transition passage 116. The inlet passage 112, inlet 114, and thetransition passage 116 may include a diverging, converging, or straightpassage, or any suitable combination thereof.

In one embodiment, the inlet passage 112 is generally cylindrical andthe inlet 114 is straight, or in other words has a constant diameter. Inthis embodiment, the transition passage 116 is converging toward thedown-stream end 104. It will be understood that the inlet passage 112may be otherwise shaped or configured without departing from the scopeof the present invention.

The nozzle cavity 110 also includes a nozzle passage 118 defined withinthe down-stream end 104 of the nozzle cavity 110. The nozzle passage 118may have an associated longitudinal length 120. In one embodiment, thelongitudinal length 120 of the nozzle passage 118 is between 0.1 and 1.0inches. In a particular embodiment, the longitudinal length 120 of thenozzle passage 118 is approximately 0.5 inches. In another embodiment,the longitudinal length 120 is sized to allow the particles of fluid 34to cluster. It will be understood that the longitudinal length 120 maybe otherwise sized without departing from the scope of the presentinvention.

The nozzle passage 118 may also include a taper 122. In one embodiment,the taper 122 forms a diverging passage from the up-stream end 102 tothe down-stream end 104 of the nozzle cavity 110. The taper 122 may bebetween 1 and 30 degrees. In a particular embodiment, the taper 122 isapproximately 6°. It will be understood that the nozzle passage 118 maybe otherwise tapered without departing from the scope of the presentinvention. For example, the taper 122 may be linear, non-linear,symmetric (i.e. conical) or non-symmetric (i.e. rectangular) and may becomplex, containing diverging, converging, or straight passages, or anysuitable combination thereof.

The down-stream end 104 of the nozzle passage 118 forms a dischargeorifice 124. A diameter or average width 126 is associated with thedischarge orifice 124. In one embodiment, the associated width 126 ofthe discharge orifice 124 is less than 0.25 inches. In a particularembodiment, the associated width 126 of the discharge orifice 124 is onthe order of 0.02 inches. It will be understood that the dischargeorifice 124 may be otherwise sized without departing from the scope ofthe present invention.

In another embodiment, the width 126 of the discharge orifice 124 may besubstantially less than the longitudinal length 120 of the nozzlepassage 118. In one embodiment, the width 126 of the discharge orifice124 is less than the longitudinal length 120 of the nozzle passage 118by a factor of at least 10. In a particular embodiment, the width 126 ofthe discharge orifice 124 is less than the longitudinal length 120 ofthe nozzle passage 118 by a factor of approximately 20. It will beunderstood that the longitudinal length 120 of the nozzle passage 118may be otherwise varied relative to the width 126 of the dischargeorifice 124 without departing from the scope of the present invention.

The transition between the inlet passage 112 and the nozzle passage 118may form a throat 128. The throat 128 may be a diverging, converging, orstraight passage, or any suitable combination thereof. The throat 128has a diameter or average width 130 associated with the throat 128. Inone embodiment, the throat 128 is a straight passage having a width 130between 0.002 and 0.030 inches. In a particular embodiment, the throat116 has an average width 130 of approximately 0.008 inches. It will beunderstood that the throat 128 may be otherwise sized without departingfrom the scope of the present invention. It will be further understoodthat the nozzle passage 118 may be otherwise configured withoutdeparting from the scope of the present invention. For example, thenozzle passage 118 may include other diverging, converging, or straightpassages, or any suitable combination thereof.

In accordance with one aspect of the present invention, the nozzlepassage 118 may be defined, at least in part, by an internal surface 132of a miniature tube insert 134. The miniature tube insert 134 may bedisposed in the nozzle cavity 110 between the inlet passage 112 and thedown-stream end 104 of the nozzle body 100. In particular, the miniaturetube insert 134 may be disposed in a tube passage 136 formed in thenozzle cavity 110. The tube passage 136 may be generally cylindrical inshape to frictionally receive the miniature tube insert 134. Inaddition, the tube passage 136 may have a diameter greater than thewidth 126 of the discharge orifice 124 in order to form a stop 138 forsecuring the miniature tube insert 134 in the nozzle body 100 duringoperation. The nozzle cavity 110 may also include a small bore passage140 fabricated between the tube passage 136 and the down-stream end 104of the nozzle body 100. It will be understood that the miniature tubeinsert 134 and the tube passage 136 may be otherwise fabricated andconfigured without departing from the scope of the present invention.

In a particular embodiment, the miniature tube insert 134 is fabricatedwith a small initial bore (not shown) within the miniature tube insert134. The small bore passage 140 is similarly fabricated with a smallinitial bore (not shown). The miniature tube insert 134 is thenfrictionally inserted into the tube passage 136 flush with the stop 138such that the initial bores are concentrically aligned. The concentricpassages are then machined together to form the continuous nozzlepassage 118. In another embodiment, the miniature tube insert 134 iselectro-formed by electro-depositing a material on the outside diameterof the miniature tube insert 134 and machining the outside diameter tothe specified diameter. The electro-formed miniature tube insert 134 canthen be welded to form the nozzle tip 106.

In an alternative embodiment, the small bore passage 140 and theinternal surface 132 of the miniature tube insert 134 are fabricatedseparately to achieve passage features that may not be achieved usingconventional fabrication techniques.

Use of the miniature tube insert 134 allows fabrication of therelatively long nozzle passage 118 in very small diameter sizes that arenot generally obtainable by conventional fabrication techniques. Inaddition, the tube passage 136 provides a sufficiently large passage formachining the small bore passage 140.

Furthermore, conventional fabrication techniques are generally expensiveand may not be able to fabricate the nozzle passage 118 to obtain thedesired fluid flow properties. After the miniature tube insert 134 hasbeen fabricated, the miniature tube insert 134 may be inserted into thetube passage 136. In an embodiment in which the stop 138 is formed, theminiature tube insert 134 is inserted until the miniature tube insert134 contacts the stop 138. In one embodiment, the miniature tube insert134 is frictionally secured within the tube passage 136. It will beunderstood that the miniature tube insert 134 may be otherwise securedwithin the tube passage 136 and nozzle cavity 110 without departing fromthe scope of the present invention.

In operation, and according to the embodiment illustrated in FIGS. 1 and2, the pressurized fluid 34 enters the nozzle 22 at the inlet 114. Thefluid 34 flows through the transition passage 116 portion of the inletpassage 112 which may be converging for a short distance. The nozzle 22is generally cooled to help maintain the temperature of the fluid 34.The fluid 34 passes through the throat 128 and into the nozzle passage118 that is diverging. The diverging nozzle passage 118 allows the fluid34 flowing through the nozzle passage 118 to expand, thereby furtherdecreasing the temperature and pressure of the fluid 34. As thetemperature and pressure of the fluid 34 decreases, the density of thefluid 34 flowing through the diverging nozzle passage 118 decreases. Thelongitudinal length 120 of the diverging discharge passage 118 issufficient to produce clustering of the cooled fluid 34 flowing throughthe nozzle 22. Clustering is the clumping together of the atoms ormolecules in the fluid 34, thereby increasing the particle size of theindividual fluid particles within the clustered fluid 34 forming thefluid plume 40. This clustering is very important to the successfulimplementation of the fluid jet as a light-generating source.

The fluid 34 exits the discharge orifice 124 of the nozzle 22 at a highspeed, generally at supersonic velocities. In one embodiment, thevelocity of the fluid 34 exiting the discharge orifice 124 isapproximately Mach 3. The high speed fluid 34 exiting the dischargeorifice 124 and contains the clustered fluid 34 which forms the fluidplume 40. As discussed previously, the input energy 64 may be directedinto the fluid plume 40 to form the plasma 66. The plasma 66 may producethe emitted energy 16 that is collected and directed by the outputoptics 18 onto the target 20.

The nozzle, although long and narrow in its internal passage must bevery small in its throat diameter or cross-section. The nozzle must alsobe of smooth and regular internal contour so as to allow for unimpededflow. The smaller the nozzle throat, the less gas will pass into thevacuum chamber at the required nozzle inlet thermodynamic state, sopumping requirements to maintain proper pressure in the vacuum chambercan be correspondingly reduced. In addition, the longitudinal length andthe taper of the nozzle passage cools the fluid and allows sufficienttime for the fluid particles to cluster. Accordingly, the fluid plumemay have fluid characteristics that are optimal for producing theemitted energy in response to the input energy. Moreover, the size andshape of the fluid plume are strictly controlled and defined.Accordingly, the optimal location for directing the input energy intothe fluid plume can be accurately determined to maximize the intensityof emitted energy produced.

FIG. 3 is a cross section illustrating a method of manufacturing verysmall diameter deep passages in accordance with one embodiment of thepresent invention. The method of manufacturing very small diameter deeppassages may be used to fabricate passages such as the inlet passage 112and the nozzle passage 118 of the nozzle 22 which cannot be readilyfabricated using conventional machining techniques. Such conventionalmanufacturing techniques include micro-machining, LASER, and ElectricalDischarge Machine (EDM) methods as well as electroforming. In additionto manufacturing very small diameter deep passages, the method may beused to fabricate other sized passages that are within the spirit andscope of the present invention.

Referring to FIG. 3, the method of manufacturing very small diameterdeep passages may include providing an article 200 having a first side202 and a second side 204. A recess 206 may be fabricated in the firstside 202 of the article 200. In one embodiment and as illustrated inFIG. 3, the recess 206 includes a first portion 208, a second portion210, a third portion 212, and a fourth portion 214. In this embodiment,each portion 208, 210, 212, and 214 is a constant diameter passage thatis concentric to the other portions. It will be understood that therecess 206 may be otherwise configured, including having other shapes,sizes, or configurations without departing from the scope of the presentinvention. Thus, the recess 206 may include a single constant diameterpassage, a single tapered passage, multiple cylindrical passages thatmay be concentric, and the like.

An article passage 216 may be formed between the second side 204 of thearticle 200 and the recess 206. The article passage 216 may be any shapeor size and include parallel or tapered surfaces, contours, or any otherdetail as required by the application. The article passage 216 on thesecond side 204 of the article 200 may form an orifice 218 having adiameter 219. Similar to the article passage 216, the orifice 218 may beany suitable shape or size without departing from the scope of thepresent invention.

An insert 220 may be provided that is sized to fit the recess 206. Forthe embodiment illustrated in FIG. 3, the insert 220 includes a firstbutton 222, a second button 224, a third button 226, and a fourth button228, wherein each button is sized to fit a corresponding portion of therecess 206. It will be understood that the insert 220 or the buttons222, 224, 226, and 228 forming the insert 220 may be otherwiseconfigured including having other shapes or sizes without departing fromthe scope of the present invention. Thus, the insert 220 may include oneor more buttons of the same or varying size and shape depending upon thesize and shape of the recess 206 and upon the application.

An insert passage 230 may be fabricated in the insert 220. The insertpassage 230 may be any shape or size and include parallel or taperedsurfaces, contours, or any other detail as required by the application.In applications where the insert 220 includes one or more buttons, theinsert passage 230 may be fabricated in each button. The insert passage230 in each button may vary in size and shape depending upon theapplication. For example, in one embodiment the insert passage 230 istapered. In another embodiment and as illustrated in FIG. 3, the insertpassage 230 is constant in each button 222, 224, 226, and 228. It willbe understood that the insert passage 230 may be other sizes, shapes, orconfigurations without departing from the scope of the presentinvention.

The insert 220 may be securably disposed within the recess 206 of thearticle 200. For the embodiment illustrated in FIG. 3, each button ofthe insert 220 is frictionally secured within that portion of the recess206 corresponding to that particular button. In particular, the firstbutton 222 is secured within the first portion 208 of the recess 206with the insert passage 230 in the first button 222 aligned with thearticle passage 216 in the article 200. The second button 224 is thensecured within the second portion 210 of the recess 206 with the insertpassage 230 in the second button 224 aligned with the insert passage 230in the first button 222. Similarly, the third button 226 is then securedwithin the third portion 212 of the recess 206 with the insert passage230 in the third button 226 aligned with the insert passage 230 in thesecond button 224. Likewise, the fourth button 228 is secured within thefourth portion 214 of the recess 206 with the insert passage 230 in thefourth button 228 aligned with the insert passage 230 in the thirdbutton 226. It will be understood that the aforementioned process ofstacking buttons within the recess may be repeated indefinitely tofabricate any diameter, size, or configuration of passage over anextended length or depth.

The article passage 216 in the article 200 and the insert passage 230 inthe insert 220 may be aligned to form an extended passage 232 that issmaller than can be fabricated using conventional fabricationtechniques.

In short, the method of manufacturing very small diameter deep passagesallows a very small diameter passage to be fabricated in an article atdepths and with precision that greatly exceed the depths and precisionthat conventional machining techniques can achieve. In addition, themethod of manufacturing very small diameter deep passages may includefabricating the very small diameter passage such that minute contoursand details, which may not be machinable using conventional machiningtechniques, may be machined into the micro-diameter passage. The methodof manufacturing very small diameter deep passages is preferably used insituations where long, small cross-section passages having accuratefeatures must be fabricated. The initial passages, such as the tubepassage, may be used to provide sufficient access for coolant,electrolyte, or an EDM wire to fabricate additional internal features.

FIG. 4 is a cross section illustrating the diffuser 28 in accordancewith one embodiment of the present invention. In this embodiment, thediffuser 28 may be used to substantially capture the fluid plume 40produced by the nozzle 22. It will be understood that the diffuser 28may be otherwise used without departing from the scope of the presentinvention.

In one embodiment, the diffuser 28 may include a generally cylindricaldiffuser body 300 having an inlet end 302 and an outlet end 304. Thediffuser body 300 may be tapered adjacent the inlet end 302 of thediffuser body 300 to form a diffuser tip 306. The diffuser body 300 mayalso include a diffuser boss 308. The diffuser boss 308 may be used tolongitudinally position and secure the diffuser 28 within the holderassembly 30. It will be understood that the diffuser body 30C may beotherwise shaped and configured without departing from the scope of thepresent invention.

A diffuser passage 310 is disposed within the diffuser body 300 andextends between the inlet end 302 and the outlet end 304. The inlet end302 of the diffuser passage 310 may include a diffuser inlet 312. Thediffuser inlet 312 may have an associated diameter or average width 314.In general, the width 314 of the diffuser inlet 312 is larger than thewidth 126 of the discharge orifice 124 in the nozzle 22 illustrated inFIG. 2. In one embodiment, the width 314 of the diffuser inlet 312 islarger than the width 126 of the discharge orifice 124 by a factor ofapproximately 10. In another embodiment, the width 314 of the diffuserinlet 312 is approximately 0.19 inches. It will be understood that thewidth 314 of the diffuser inlet 312 may be otherwise sized withoutdeparting from the scope of the present invention.

The diffuser passage 310 may also include a diffuser entry passage 316extending from the diffuser inlet 312 toward the outlet end 304. Thediffuser entry passage 316 may include a taper 318. The taper 318 mayform a converging, diverging, or straight diffuser entry passage 316. Inone embodiment, the diffuser entry passage 316 is a diverging passage inthat the diameter of the diffuser entry passage 316 increases from thediffuser inlet 312. In this embodiment, the taper 318 of the diffuserentry passage 316 is less than 90 degrees. In a particular embodiment,the taper 318 of the diffuser entry passage 316 is approximately 30degrees. It will be understood that the diffuser entry passage 316 maybe otherwise configured and internally contoured without departing fromthe scope of the present invention.

The diffuser entry passage 316 may have an associated longitudinallength 320. In one embodiment, the longitudinal length 320 of thediffuser entry passage 316 is between 0.1 and 2.5 inches. In aparticular embodiment, the longitudinal length 320 of the diffuser entrypassage 316 is approximately 0.5 inches. It will be understood that thelongitudinal length 320 of the diffuser entry passage 316 may beotherwise sized without departing from the scope of the presentinvention.

The diffuser passage 310 may also include a center passage 322 extendingfrom the diffuser entry passage 316 to the outlet end 304 of thediffuser passage 310. The center passage 322 may be a converging,diverging, or straight passage. The center passage 322 may have anassociated diameter or average width 324. In one embodiment, the width324 of the center passage 322 is constant such that the center passage322 is a straight passage. In this embodiment, the width 324 of thecenter passage 322 is between 2 and 10 times larger than the width 314of the diffuser inlet 312. In a particular embodiment, the width 324 ofthe center passage 322 is approximately 3 times larger than the width314 of the diffuser inlet 312. It will be understood that the centerpassage 322 may be otherwise configured and sized without departing fromthe scope of the present invention. It will be further understood thatthe diffuser passage 310 may be otherwise configured, including otherand different tapered passages without departing from the scope of thepresent invention.

The dimensions of the diffuser 28 may be varied substantially dependingupon the application. In particular, the configuration of the diffuserinlet 312, the longitudinal length 320 and the taper 318 of the diffuserentry passage 316, and the length and configuration of the centerpassage 322 may be optimized for each application to obtain desirablerecovery of the fluid 34 and to minimize contamination of the chamber42.

In operation, and as illustrated in FIGS. 1 and 4, the fluid 34 from thefluid plume 40 is substantially captured by the diffuser inlet 312 ofthe diffuser passage 310. The fluid 34 flows through the diffuser inlet312 into the diffuser entry passage 316 which is a diverging passagethat helps prevent the fluid 34 from back-streaming out of the diffuserpassage 310 into the chamber 42. The fluid 34 then flows through thecenter passage 322 to the outlet end 304 of the diffuser passage 310where the fluid 34 is removed by the recycle system 44, as illustratedin FIG. 1.

In short, the diffuser in combination with the nozzle is configured toutilize the dynamic properties of the fluid to direct the fluid, andother contaminants formed during operation of the emitted energy system,into the diffuser to increase the pressure within the diffuser. Theincreased pressure of the fluid within the diffuser reduces the pumpingrequirements of the chamber pump. Accordingly, the cost of the emittedenergy system may be decreased. The diffuser also reduces plasma-inducederosion by capturing contaminants that may contaminate the emittedenergy system or condense on optic elements. Furthermore, the diffusermaximizes the emitted energy collected and transmitted by the outputoptics and helps promote stable, continuous system operation.

FIGS. 5 and 6 are rotated side views in section with portions brokenaway illustrating a holder assembly 30 in accordance with one embodimentof the present invention. The holder assembly 30 operates to restrainand align the diffuser 28 with the nozzle 22 during operation of theemitted energy system 10. It will be understood that the holder assembly30 may be otherwise used without departing from the scope of the presentinvention.

In one embodiment, the holder assembly 30 includes a housing assembly400 in the configuration of an annular ring having an aperture 402. Thehousing assembly 400 may include a nozzle end 404 and a diffuser end406. In one embodiment, the housing assembly 400 includes a nozzlereceiver 408 and a diffuser receiver 410 coupled together by at leastone bolt 412. In this embodiment, the housing assembly 400 may includethermal insulation (not shown) between the nozzle receiver 408 and thediffuser receiver 410. The thermal insulation aids in the precisecontrol of the temperature of both the nozzle receiver 408 and thediffuser receiver 410. It will be understood that the holder assembly 30may be otherwise configured without departing from the scope of thepresent invention. For example, the housing assembly 400 may beconfigured as a single piece annular ring, or other suitableconfiguration.

A nozzle mounting system 414 may be coupled to the nozzle end 404 of thehousing assembly 400. The nozzle mounting system 414 operates torestrain and longitudinally align the nozzle 22 within the housingassembly 400. In one embodiment, the nozzle mounting system 414 includesa nozzle bore 416 radially disposed within the nozzle receiver 408. Inthis embodiment, the nozzle 22 is inserted and positioned within thenozzle bore 416.

The nozzle mounting system 414 may include a nozzle longitudinalalignment system 418. The nozzle longitudinal alignment system 418 mayinclude a nozzle shim 420 inserted between the housing assembly 400 andthe boss 108 illustrated in FIG. 2 The nozzle shim 420 provides preciselongitudinal positioning of the nozzle 22 within the housing assembly400. It will be understood that the nozzle longitudinal alignment system418 may be otherwise configured without departing from the scope of thepresent invention.

The nozzle mounting system 414 may also comprise a nozzle retainingsystem 422. In one embodiment, the nozzle retaining system 422 maycomprise a lock nut or a wedge fitting to restrain or lock the nozzle 22in position within the housing assembly 400. It will be understood thatthe nozzle retaining system 422 may comprise other devices or systemsfor restraining the nozzle 22 in the housing assembly 400 withoutdeparting from the scope of the present invention. It will be furtherunderstood that the nozzle mounting system 414 may comprise otherdevices or systems for restraining and aligning the nozzle 22 in thehousing assembly 400 without departing from the scope of the presentinvention.

A diffuser mounting system 430 may be coupled to the diffuser end 406 ofthe housing assembly 400. The diffuser mounting system 430 may be anydevice or system for restraining and longitudinally aligning thediffuser 28 within the housing assembly 400. In one embodiment, thediffuser mounting system 430 may include a diffuser bore 432 radiallydisposed within the diffuser receiver 410. In this embodiment, thediffuser 28 is inserted and positioned within diffuser bore 432.

The diffuser mounting system 430 may include a diffuser longitudinalalignment system 434. The diffuser longitudinal alignment system 434 mayinclude a diffuser shim 436 inserted between the housing assembly 400and the diffuser boss 308. The diffuser shim 436 provides preciselongitudinal positioning of the diffuser 28 within the housing assembly400. It will be understood that the diffuser longitudinal alignmentsystem 434 may be otherwise configured without departing from the scopeof the present invention.

The diffuser mounting system 430 may also include a diffuser retainingsystem 438. In one embodiment, the diffuser retaining system 438 maycomprise a lock nut or a wedge fitting to restrain or lock the diffuser28 in position within the housing assembly 400. It will be understoodthat the diffuser retaining system 438 may be any device or system forrestraining the diffuser 28 in the housing assembly 400 withoutdeparting from the scope of the present invention. It will be furtherunderstood that the diffuser mounting system 430 may comprise otherdevices or systems for restraining and aligning the diffuser 28 in thehousing assembly 400 without departing from the scope of the presentinvention.

The holder assembly 30 may also include an alignment system 450 thatoperates to provide spatial alignment between the nozzle 22 and thediffuser 28 to optimize operation of the diffuser 28. The alignmentsystem 450 may include the nozzle longitudinal alignment system 418 anda diffuser longitudinal alignment system 452, along with a lateralalignment system 452.

In one embodiment, the lateral alignment system 452 may include shims(not shown) in the nozzle bore 416, the diffuser bore 432, and/orbetween the nozzle receiver 408 and the diffuser receiver 410. Thelateral alignment system 452 may also include oversized holes (notshown) used in the housing assembly 400 at each bolt 412 location. Thelateral alignment system 452 operates to adjust the nozzle 22 and thediffuser 28 such that a flow centerline 454 of the nozzle 22 and theflow centerline 456 of the diffuser 28 are parallel or substantiallyinline. It will be understood that the lateral alignment system 452 maybe otherwise configured without departing from the scope of the presentinvention. It will be further understood that the alignment system 450may include other spatial positioning devices and systems withoutdeparting from the scope of the present invention.

The holder assembly 30 may also include a cooling system 458 formaintaining the temperature of the holder assembly 30 precisely within aspecified range. In one embodiment, the cooling system 458 includes acooling jacket (not shown), connecting lines (not shown), and arefrigeration system (not shown). In this embodiment, the cooling system458 circulates a cooling fluid (not shown) through the cooling jacket tocool the housing assembly 400, the nozzle 22, and the diffuser 28. Inanother embodiment, the cooling system 458 circulates the cooling fluidthrough coolant passages 460 within the housing assembly 400. In aparticular embodiment, the cooling system 458 individually cools thenozzle receiver 408 and the diffuser receiver 410. It will be understoodthat the cooling system 458 may be otherwise configured withoutdeparting from the scope of the present invention.

The holder assembly 30 may also include a radiative heat shield 462formed within the aperture 402 of the housing assembly 400. In oneembodiment, the shield 462 may be substantially cylindrical and includea reflective coating that forms a component of the output optics 18 andinhibits radiative heat transfer from the emitted energy 16 to thehousing assembly 400. The shield 462 may have a separate cooling linesystem (not shown) for cooling the radiative heat shield 462. It will beunderstood that the shield 462 may be otherwise configured to allow theemitted energy 16 to be reflected while minimally obstructing thecollection of the emitted energy 16 during the operation of the emittedenergy system 10.

An insulator 464 may be disposed between the housing assembly 400 andthe shield 462. The shield 462 may have an increased temperature due tothe effects of the emitted energy 16. The insulator 464 operates toinsulate the housing assembly 400 from the temperature effects of theshield 462 that would otherwise increase the temperature of the housingassembly 400. In one embodiment, the insulator 464 comprises a gapbetween the housing assembly 400 and the shield 462. It will beunderstood that the insulator 464 may be comprise other suitableinsulating materials and be otherwise formed without departing from thescope of the present invention.

The holder assembly 30 allows the nozzle 22 and the diffuser 28 to beprealigned as a subsystem 13. The subsystem 13 reduces the systemdowntime and maintenance and increases productivity, by allowing thesubsystem 13 to be replaced as a unit.

In short, the holder assembly maintains an accurate alignment betweenthe nozzle and diffuser. The holder assembly also allows the alignmentbetween the nozzle and the diffuser to be maintained over an extendedoperational period of time. In addition, the holder assembly helpsprotect the nozzle and diffuser from the adverse affects of the emittedenergy system, such as radiative heat from the emitted energy.

Although the present invention has been described with severalembodiments, various changes and modifications may be suggested to oneskilled in the art. It is intended that the present invention encompasssuch changes and modifications as fall within the scope of the presentappended claims.

What is claimed is:
 1. A holder assembly comprising: a nozzle coupled toa housing assembly; a diffuser coupled to the housing assembly; and analignment system operable to align the nozzle and the diffuser inspatial relationship with each other to optimize operation of thediffuser in relation to the nozzle such that the diffuser captures amajor portion of a fluid passing through the nozzle.
 2. The holderassembly of claim 1, further comprising a nozzle mounting system coupledto the housing assembly to secure the nozzle.
 3. The holder assembly ofclaim 1, further comprising a diffuser mounting system coupled to thehousing assembly to secure the diffuser.
 4. The holder assembly of claim1, the alignment system comprising a lateral adjustment system coupledto the housing assembly, the lateral adjustment system operable toadjust a lateral spatial relationship between the nozzle and thediffuser.
 5. The holder assembly of claim 4, the housing assemblyfurther comprising a nozzle receiver and a diffuser receiver that forms,at least in part, the lateral adjustment system.
 6. The holder assemblyof claim 1, the housing assembly comprising an annular ring having anaperture.
 7. The holder assembly of claim 6, wherein the nozzle anddiffuser are radially disposed within the annular ring opposite of oneanother.
 8. The holder assembly of claim 6, further comprising aradiative heat shield disposed within the aperture.
 9. The holderassembly of claim 8, further comprising an insulator disposed betweenthe radiative heat shield and the aperture of the housing assembly. 10.The holder assembly of claim 1, further comprising a cooling systemoperable to cool the housing assembly.
 11. An emitted energy system forfabricating a semiconductor device, the emitted energy systemcomprising: an energy system and a fluid system that interact to producean emitted energy, the emitted energy directed at a photolithographysystem interface to produce the semiconductor device; wherein the fluidsystem includes a holder assembly comprising: a nozzle coupled to ahousing assembly; a diffuser coupled to the housing assembly; and analignment system operable to align the nozzle and the diffuser inspatial relationship with each other to optimize operation of thediffuser in relation to the nozzle such that the diffuser captures amajor portion of a fluid passing through the nozzle while maximizing thetransmitted energy produced by the emitted energy system.
 12. Theemitted energy system of claim 11, the alignment system comprising alateral adjustment system operable to spatially align a centerline ofthe nozzle with a centerline of the diffuser.
 13. The emitted energysystem of claim 12, the housing assembly comprising an upper receiverand a lower receiver that forms, at least in part, the lateraladjustment system.
 14. The emitted energy system of claim 11, thehousing assembly further comprising an aperture.
 15. The emitted energysystem of claim 14, further comprising a radiative heat shield disposedwithin the aperture.
 16. The emitted energy system of claim 14, whereinthe nozzle and the diffuser are radially disposed within the housingassembly opposite one another.
 17. The emitted energy system of claim11, further comprising a nozzle mounting system coupled to the housingassembly to secure the nozzle.
 18. The emitted energy system of claim11, further comprising a diffuser mounting system coupled to the housingassembly to secure the diffuser.
 19. A method of manufacturing a holderassembly to secure a nozzle and a diffuser, the method comprising:providing a housing assembly having an aperture therein; fabricating anozzle mounting system in the housing assembly; fabricating a diffusermounting system in the housing assembly; and fabricating an alignmentsystem in the housing assembly, the alignment system being operable tovary the spatial relationship between the nozzle and the diffuser. 20.The method of claim 19, further comprising forming a radiative heatshield in the aperture.
 21. The method of claim 20, further comprisingforming an insulator between the radiative heat shield and the housingassembly, the insulator substantially surrounding the aperture.
 22. Themethod of claim 19, wherein providing a housing assembly comprisesproviding a housing assembly having an upper receiver and a lowerreceiver.
 23. A holder assembly comprising: a nozzle coupled to ahousing assembly; a diffuser coupled to the housing assembly; anaperture in the housing assembly; and a radiative heat shield disposedwithin the aperture.
 24. The holder assembly of claim 23, furthercomprising a nozzle mounting system coupled to the housing assembly tosecure the nozzle.
 25. The holder assembly of claim 23, furthercomprising a diffuser mounting system coupled to the housing assembly tosecure the diffuser.
 26. The holder assembly of claim 23, furthercomprising an alignment system operable to align the nozzle and thediffuser in spatial relationship with each other.
 27. The holderassembly of claim 26, the alignment system comprising a lateraladjustment system coupled to the housing assembly, the lateraladjustment system operable to adjust a lateral spatial relationshipbetween the nozzle and the diffuser.
 28. The holder assembly of claim23, the housing assembly comprising an annular ring.
 29. The holderassembly of claim 28, wherein the nozzle and diffuser are radiallydisposed within the annular ring opposite of one another.
 30. The holderassembly of claim 23, further comprising an insulator disposed betweenthe radiative heat shield and the aperture of the housing assembly. 31.The holder assembly of claim 23, further comprising a cooling systemoperable to cool the housing assembly.
 32. An emitted energy system forfabricating a semiconductor device, the emitted energy systemcomprising: an energy system and a fluid system that interact to producean emitted energy, the emitted energy directed at a photolithographysystem interface to produce the semiconductor device; wherein the fluidsystem includes a holder assembly comprising: a nozzle coupled to ahousing assembly; a diffuser coupled to the housing assembly; anaperture in the housing assembly; and a radiative heat shield disposedwithin the aperture.
 33. The emitted energy system of claim 32, furthercomprising a nozzle mounting system coupled to the housing assembly tosecure the nozzle.
 34. The emitted energy system of claim 32, furthercomprising a diffuser mounting system coupled to the housing assembly tosecure the diffuser.
 35. The emitted energy system of claim 32, furthercomprising an alignment system operable to align the nozzle and thediffuser in spatial relationship with each other.
 36. The emitted energysystem of claim 35, the alignment system comprising a lateral adjustmentsystem operable to spatially align a centerline of the nozzle with acenterline of the diffuser.
 37. The emitted energy system of claim 32,the housing assembly comprising an annular ring.
 38. The emitted energysystem of claim 32, wherein the nozzle and the diffuser are radiallydisposed within the housing assembly opposite one another.
 39. Theemitted energy system of claim 32, further comprising an insulatordisposed between the radiative heat shield and the housing assembly. 40.A method of manufacturing a holder assembly, the method comprising:providing a housing assembly having an aperture therein; fabricating anozzle mounting system in the housing assembly; fabricating a diffusermounting system in the housing assembly; and forming a radiative heatshield within the aperture.
 41. The method of claim 40, furthercomprising fabricating an alignment system in the housing assembly, thealignment system operable to vary the spatial relationship between thenozzle and the diffuser.
 42. The method of claim 40, wherein providing ahousing assembly comprises providing a housing assembly having anannular ring.
 43. The method of claim 40, wherein providing a housingassembly comprises providing a housing assembly having an upper receiverand a lower receiver.
 44. The method of claim 40, further comprisingforming an insulator between the radiative heat shield and the housingassembly.